*
*
Burn-in Sockets
•
Products:
 
–
BGA:
0.3 mm Pitch CSP
0.4 mm Pitch CSP
0.5 mm Pitch CSP
0.65 mm Pitch CSP
0.75 mm Pitch CSP
0.80 mm Pitch CSP
1.0 mm Pitch
1.27 mm Pitch
Memory Sockets
 
–
LGA
 
–
QFP
 
–
Others
•
Engineering
 
–
Contact Technology:
Buckling Beam
Pinch Style
 
–
Platform Design
•
Contact Us
•
Make an Online Request
•
Terms & Conditions


Looking for a specific socket? Click here.


0.3 mm pitch CSP in development!

Call now. Let us capture your 0.3 mm-pitch input!
*

Tel: 1-508-236-1868
*

burninsockets@sensata.com
*

sensata.com/burninsockets

Site Updated February 16, 2018

 * * * Sensata > Products > Burn-in Sockets >

BGA (Ball Grid Array) Burn-in Test Sockets & Memory Sockets
Many Pitch Sizes Available


All, By Pitch Size
0.30mm pitch
0.40mm pitch
0.50mm pitch
0.65 mm pitch
0.75 mm pitch
0.80 mm pitch
1.00mm pitch
1.27 mm pitch
*
CSP Only, By Pitch Size
Chip scale packages:
0.30mm pitch
0.40mm pitch
0.50mm pitch
0.65 mm pitch
0.75 mm pitch
0.80 mm pitch

BGA Memory Sockets
Memory Sockets
* * *
*
24/7 Worldwide Support
*
CSP Leaders
*
Interconnect Since 1970
*

Product Brochures

CSP 0.5mm Pitch Brochure
0.5 mm Pitch BGA CSP (PDF)
4/26/05
720KB
2 Pages
Logic Brochure
Logic (PDF)
February, 2008
3.7MB
6 Pages
Memory Brochure
Memory (PDF)
4/26/05
2.1MB
4 Pages

Chipscale Ad See our ad in Chipscale Review magazine »
The World Depends on Sensors and Controls
©2018 Sensata Technologies, Inc. All rights reserved. Policies, Legal, Terms of Use Your Privacy Site Map Follow Us Facebook Linked In Linked In