Sensata | IC Interconnect Burn-In Test Socket Engineering by Sensata

Burn-in Sockets
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	–	BGA: 0.3 mm Pitch CSP 0.4 mm Pitch CSP 0.5 mm Pitch CSP 0.65 mm Pitch CSP 0.75 mm Pitch CSP 0.80 mm Pitch CSP 1.0 mm Pitch 1.27 mm Pitch Memory Sockets
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Technical Paper

Burn-in Test Sockets for Chip Scale Packages: Overcoming the Challenges of Fine Pitch BGA
Written in 1998 By James A. Forster, Kiyokazu Ikeya, Masao Tohyama, Sal P. Rizzo

Site Updated February 16, 2018

Sensata > Support > Burn-in Test Socket Engineering

IC Burn-In Test Socket Engineering

24/7 Global Support Teams, Local Support

Sensata doesn’t only set standards for core and custom burn-in test solutions, we also advance next–generation package roadmap requirements—including emerging chip scale packaging design, manufacturing, and assembly techniques.

These worldwide design efforts are supported by the resources of our Advanced Analysis and Computational Development Laboratory. Our global engineering staff will partner with you to determine and design your burn-in test sockets, with advanced communications apps at the ready.

To learn more, please contact us »

Tailored Engineering

•	Latest 3D design tools
•	On-site model shops
•	Rapid prototyping
•	Advanced thermal analysis
•	Design on demand
•	24/7 global engineering
•	Expert molding, design, & customization
•	Buckling beam contact

For interconnection testing that demands a more tailored approach, we offer a full range of technical expertise and burn-in socket solutions led by our CSP sockets.

Worldwide Support

•	24/7 global engineering
•	24/7 global support teams
•	Local engineering & sales
•	Six Sigma quality management
•	Proven, reliable high-volume manufacturing

24-hour global support, seven days a week, supports our rapid response. With engineering teams in key geographic locations, including Japan, Korea, and North America, our team is never more than a few hours from your facility. Our distributed design and decision making capability allows our local application engineers and sales staff to meet with you in real time and make decisions today.

24/7 Worldwide Support

CSP Leaders

Interconnect Since 1970

Product Brochures

	0.5 mm Pitch BGA CSP (PDF) 4/26/05 720KB 2 Pages
	Logic (PDF) 4/26/05 3.3MB 6 Pages
	Memory (PDF) 4/26/05 2.1MB 4 Pages

Call now. Let us capture your 0.3 mm-pitch input!

Tel: 1-508-236-1868

burninsockets@sensata.com

sensata.com/burninsockets

IC engineering and design that includes:

FEA and 3D Modelling

Using the latest 3D design tools such as SolidWorks and non–linear FEA analysis, our engineers create new designs in shorter periods of time.

Prototyping

The availability of on–site model shops and rapid prototyping facilities allows the creation of prototypes so that customers can evaluate new designs and concepts.

Thermal and Mechanical Testing

A comprehensive technical service laboratory with advanced thermal analysis capabilities and wind tunnels allows Sensata to evaluate a socket’s thermal characteristics.

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