Accommodating package sizes from 15x15mm to 5x5mm, the TI Interconnection burn-in socket portfolio for 0.5 mm pitch BGA packages is available in both compression mount and through–hole.
Sensata Interconnection 0.5 mm pitch burn-in sockets employ a vertically actuated “compression” style contact that interfaces with individual solder balls. The contact-to-ball, interfaced at two locations per ball, gives minimum spherical deformation while providing a reliable electrical connection. The contact systems used accommodate both Pb and Pb–free balls.
Above: (Left) Buckling beam, used for BGA pitches 0.5 mm and below. (Right) 0.5 mm buckling beam, TI Internal SEM photograph showing consistent alignment of witness mark.
| Mechanical Characteristics |
Contact system |
Normally uncompressed |
Package insertion force |
ZIF |
Contact force |
Typical: Approximately 12g/pin
Range: 10–14g/pin |
Durability |
Minimum: 10,000 cycles |
Temperature range |
-55°C to 150°C |
Contact point |
Side of solder ball |
Maximum IC offset |
During load: ±1.0 mm in X or Y axis |
Actuation force |
1.2kg to 5.0kg |
| Electrical Characteristics |
Current rating |
0.25 amp per pin |
Insulation resistance |
1000 Mohms at 500V DC |
Dielectric voltage |
Withstands 500V AC for 1 minute |
Contact resistance at 10mA |
Initial: 100 mohm maximum
After 10K cycles: 1 ohm maximum |
Inductance |
6nH at 50 MHz, approximately |
