Sensata IC | 0.4 mm Pitch CSP BGA Burn-In Test Sockets by Sensata

Burn-in Sockets
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Site Updated February 16, 2018

Sensata > Products > Burn-in Sockets > BGA > CSP >

Burn-in Test Socket: 0.4 mm Pitch CSP

Available in Compression Mount or Through–hole

•		Proven contact — No contact on bottom of ball, contact life exceeds 10,000 actuations
•		Small socket outline — From 26x19.5mm to 40x40mm
•		Interchangeable adapter
•		Various package sizes available — up to 15x15mm
•		Assembled in controlled environment
•		Open top — Open top auto–load actuated socket
•		Through–hole and compression mount
•		Low actuation force — From 1.2kg, depending on pin count

Mechanical Characteristics
Contact system	Buckling beam (more info) Dual pinch (more info)
Package insertion force	ZIF
Contact force	Range: 10–14g/pin
Durability	Minimum: 10,000 actuations
Temperature range	-55°C to 150°C
Contact point	Side of solder ball
Actuation force	From 1.2kg, depending on pin count

Electrical Characteristics
Current rating	0.25 amp per pin @ 125°C
Insulation resistance	1000 Mohms at 500VDC
Dielectric voltage	Withstands 500VDC for 1 minute
Contact resistance at 10mA	Initial: 150 mohm maximum After 10K cycles: 1 ohm maximum
Inductance	6nH at 50 MHz, approximately

SEM image of 0.50mm pitch BGA

This SEM image shows an array of solder balls on the 0.50mm BGA package after burn-in at 140°C. Note the uniformity of the alignment of the contact witness marks, illustrating the accurate alignment features of the Sensata socket.

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