Sensata IC | Burn-In Test Socket Product Line Since 1970, Offered by Sensata

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Burn-in Sockets
•	Products:
	–	BGA: 0.3 mm Pitch CSP 0.4 mm Pitch CSP 0.5 mm Pitch CSP 0.65 mm Pitch CSP 0.75 mm Pitch CSP 0.80 mm Pitch CSP 1.0 mm Pitch 1.27 mm Pitch Memory Sockets
	–	LGA
	–	QFP
	–	Others
•	Engineering
	–	Contact Technology: Buckling Beam Pinch Style
	–	Platform Design
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Product Brochures

	0.5 mm Pitch BGA CSP (PDF) 4/26/05 720KB 2 Pages
	Logic (PDF) February, 2008 3.7MB 6 Pages
	Memory (PDF) 4/26/05 2.1MB 4 Pages

See our ad in Chipscale Review magazine »

Site Updated February 16, 2018

Sensata > Products > Burn-in Sockets >

IC Burn-in Test Socket Product Overview

Solutions for the Industry’s Most Demanding CSP Requirements

Whether you are looking from our existing portfolio of burn-in test sockets or a custom CSP solution, Sensata offers unmatched capacity, worldwide bandwidth and manufacturing flexibility. Our global workforce is ready to partner with you to find the best solution, no matter what you need.

I/O Chart

24/7 Worldwide Support

CSP Leaders

Interconnect Since 1970

Call now. Let us capture your 0.3 mm-pitch input!

Tel: 1-508-236-1868

burninsockets@sensata.com

sensata.com/burninsockets

BGA

Ball Grid Array Packages

LGA

Land Grid Array Packages

QFP

Quad Flat Pack Packages

Other Packages Available

The future is clear... More I/O at smaller sizes.
Our team creates next generation sockets so that we have the best solution, at the right time, to meet your semiconductor socket needs.

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