Sensata IC | Additional Burn-In Test Sockets Made by Sensata

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Burn-in Sockets
•	Products:
	–	BGA: 0.3 mm Pitch CSP 0.4 mm Pitch CSP 0.5 mm Pitch CSP 0.65 mm Pitch CSP 0.75 mm Pitch CSP 0.80 mm Pitch CSP 1.0 mm Pitch 1.27 mm Pitch Memory Sockets
	–	LGA
	–	QFP
	–	Others
•	Engineering
	–	Contact Technology: Buckling Beam Pinch Style
	–	Platform Design
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Tel: 1-508-236-1868

burninsockets@sensata.com

sensata.com/burninsockets

Site Updated February 16, 2018

Sensata > Products > Burn-in Sockets >

Additional Burn-In Test Sockets Made by Sensata

Sensata can meet just about any IC burn-in and testing requirement you can come up with... And we have the proven global deployment to support it. Our Interconnect portfolio supports the top memory, microprocessor, ASIC, and logic companies worldwide, and has been since 1970.

To learn more, please contact us »

We offer a huge array of custom solutions. Request more information by clicking here.

•	Latest 3D design tools
•	On-site model shops
•	Rapid prototyping
•	Advanced thermal analysis
•	Design on demand
•	24/7 global engineering
•	Expert molding, design, & customization
•	Buckling beam contact
•	24/7 global support teams
•	Local engineering & sales
•	Six Sigma quality management
•	Proven, reliable high-volume manufacturing